|
textos901docs (4562,5): c4f8, plasma polymerization, peel force, demolding sqlexec
criterio: (id='2142003')
gis.where: content. gis.searchtype: instr. gis.page: 1. gis.count: 1 ejecutor: d gis.verb: GetRecord / content
******************************************************* sss: SELECT id AS RegistroID, reemplazos AS MReemplazos, categ as VALERIO, marc AS Content, iduri AS uri, resumen AS rtags, sortby AS ordenado FROM negun WHERE ((id='2142003')) LIMIT 0,1;
Keywords (GIS/901a) 4750: C4F8|plasma polymerization|peel force|demolding
Entidad: IPHS (4765,625): oai:dspace.mit.edu:1721.1/7462
Plasma polymerization of C[subscript 4]F[subscript 8] thin film on high aspect ratio silicon molds Plasma polymerization of C4F8 thin film on high aspect ratio silicon molds
High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical
Publicidad
iii.script.c
Contenidos
High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical. Second generation PDMS molds are replicated against first generation silicon molds created by deep reactive ion etching. In order to ensure successful demolding, the silicon molds are coated with a thin layer of C[subscript 4]F[subscript 8] plasma polymer to reduce the adhesion force. Peel force and demolding status are used to determine if delamination is successful. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of C[subscript 4]F[subscript 8]. Singapore-MIT Alliance (SMA)
~plasma polymerization of c[subscript 4]f[subscript 8] thin film on high aspect ratio silicon molds~plasma polymerization of c4f8 thin film on high aspect ratio silicon molds (Equipo)
Poh, S. L. Lam, Yee Cheong Chan-Park, Mary Bee-Eng
~plasma polymerization of c[subscript 4]f[subscript 8] thin film on high aspect ratio silicon molds~plasma polymerization of c4f8 thin film on high aspect ratio silicon molds (Responsables)
Yeo, L. P.
Keywords (901a / 4765,625)
KeywordsC4F8 plasma polymerization peel force demolding
Vincular (851 / 4765,625)
AAAAAAAAAAAA
|
|
|
|