A French technological centre has developed a patented process, which allows structural adhesive bonding to be easily removed. Thanks to this process, substrates cleaning, recycling and maintenance operations become easier and cheaper. It could be applied in various fields such as aeronautic, aerospace, automotive, construction and the microelectronic sector.
The required partner is an industrial company of the sectors aeronautic, automobile, electronic and building.

The patented process, already developed with industrial partners, is suitable for use with the usual substrates and structural adhesives such as epoxy resins, polyurethanes or acrylics. The process in based on any adhesives formulated with a specific chemical compound called blowing agent. This process could be applied in various fields such as aeronautic, aerospace, automotive, construction and the microelectronic sector.

Innovative Aspects:

Adding this “inert” compound to the adhesive does not alter the storage or application.

Moreover setting, mechanical bonding properties and joint service life are not damaged. When structural bonding must be removed, energy supply initiates the activation of blowing agent and then substrates can be easily disassembled

Main Advantages:

This innovation technology fits into a new environmental policy called “eco-conception”. Indeed, thanks to this process, substrates cleaning, recycling and maintenance operations become easier and cheaper.

• Cours du Médoc, 185
• F - 33042
• Tel.: +33 5 56 11 94 90
• Tel.: +33 5 56 11 94 82
• Fax.: +33 5 56 11 94 90
• thomas.lamare@aquitaine.cci.fr